This bundle consists of an MGC3130 Hillstar Development Kit and a 3D TouchPad from Microchip. The dev kit comprises an MGC3130 Module, an I²C to USB Bridge Module, a 4-layer Reference Electrode (95 x 60 mm sensitive area), a ‘Hand Brick’ set (self-assembly, 4 foam blocks, 1 copper foil) and a USB cable for PC connection. The kit enables the MGC3130 to be parameterized and the associated Gestic technology, which is designed to detect changes in a transmitted E-field corresponding to capacitive changes in the femtofarad range (1 fF = 10–15 F), to be explored in great depth.
The downloadable Aurea software tool provides a graphic aid to viewing signals, perform logging, and set up the MGC3130. The kit also provides advice and tools to designing electrodes specifically for your application.
The 3D Touchpad is a ready manufactured 3D Tracking and Gesture controller with mouse functionality included. Out of the box it adds a large sensitive touchpad to any PC, tablet or embedded system with USB. Internally, a single PCB implements both the electrodes for the 3D sensing as well as the touch sensor matrix for the touchpad.
The 3D Touchpad and the Hillstar MGC3130 Development Kit together provide a solid basis for making 3D control a reality on embedded systems including Arduino, RPi, BBB, T-Boards and others.
|Manufacturer||Microchip Technology Inc.|