Upgraded T-962 v2.0 Reflow Soldering Oven (Elektor Version)

Description

This upgraded version 2.0 (available exclusively from Elektor) contains the following improvements:

  • Enhanced protective earthing (PE) for furnace chassis
  • Extra thermal insulation layer around furnace to reduce odors
  • Connection to a computer, allowing curve editing on a PC
  • Features such as constant temperature control and timing functions

The infrared IC heater T-962 v2.0 is a microprocessor-controlled reflow oven that you can use for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared emission and circulation of the hot air flow, so the temperature is being kept very accurate and evenly distributed.

A windowed drawer is designed to hold the work-piece, and allows safe soldering techniques and the manipulation of SMDBGA and other small electronic parts mounted on a PCB assembly. The T-962 v2.0 may be used to automatically rework solder to correct bad solder joints, remove/replace bad components and complete small engineering models or prototypes.

Features

Large infrared soldering area

Effective soldering area: 180 x 235 mm; this increases the usage range of this machine drastically and makes it an economical investment.

Choice of different soldering cycles

Parameters of eight soldering cycles are pre defined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.

Special heat up and temperature equalization with all designs

Uses up to 800 Watts of energy efficient Infrared heating and air circulation to re-flow solder.

Ergonomic design, practical and easily operated

Good build quality but at the same time light weight and a small footprint allows the T-962 v2.0 to be easily bench positioned transported or stored.

Large number of available functions

The T-962 v2.0 can solder most small parts of PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.

Specifications

Soldering area (max) 180 x 235 mm (7.1 x 9.3")
Power (max) 800 W
Temperature range 0-280°C (32-536°F)
Heating method Infrared
Processing time 1~8 minutes
Power supply 220 V AC/50 Hz
Display LCD with Backlight
Control mode 8 intelligent temperature curves
Dimensions 310 x 290 x 170 mm (12.2 x 11.4 x 6.7")
Weight 6.2 kg

Included

  • 1x T-962 v2.0 Reflow Soldering Oven (Elektor Version)
  • 1x USB Stick (with Manual and Software)
  • 2x Fuses
  • 1x Power cord (EU)

Downloads


Product form

This upgraded version 2.0 (available exclusively from Elektor) contains the following improvements: Enhanced protective earthing (PE) for furnace chassis Extra... Read more

Pre-order

€ 289,00 € 249,00 (incl. VAT)
Members identical

    Details

    SKU: 20346
    EAN: 020346

    Description

    This upgraded version 2.0 (available exclusively from Elektor) contains the following improvements:

    • Enhanced protective earthing (PE) for furnace chassis
    • Extra thermal insulation layer around furnace to reduce odors
    • Connection to a computer, allowing curve editing on a PC
    • Features such as constant temperature control and timing functions

    The infrared IC heater T-962 v2.0 is a microprocessor-controlled reflow oven that you can use for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared emission and circulation of the hot air flow, so the temperature is being kept very accurate and evenly distributed.

    A windowed drawer is designed to hold the work-piece, and allows safe soldering techniques and the manipulation of SMDBGA and other small electronic parts mounted on a PCB assembly. The T-962 v2.0 may be used to automatically rework solder to correct bad solder joints, remove/replace bad components and complete small engineering models or prototypes.

    Features

    Large infrared soldering area

    Effective soldering area: 180 x 235 mm; this increases the usage range of this machine drastically and makes it an economical investment.

    Choice of different soldering cycles

    Parameters of eight soldering cycles are pre defined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.

    Special heat up and temperature equalization with all designs

    Uses up to 800 Watts of energy efficient Infrared heating and air circulation to re-flow solder.

    Ergonomic design, practical and easily operated

    Good build quality but at the same time light weight and a small footprint allows the T-962 v2.0 to be easily bench positioned transported or stored.

    Large number of available functions

    The T-962 v2.0 can solder most small parts of PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.

    Specifications

    Soldering area (max) 180 x 235 mm (7.1 x 9.3")
    Power (max) 800 W
    Temperature range 0-280°C (32-536°F)
    Heating method Infrared
    Processing time 1~8 minutes
    Power supply 220 V AC/50 Hz
    Display LCD with Backlight
    Control mode 8 intelligent temperature curves
    Dimensions 310 x 290 x 170 mm (12.2 x 11.4 x 6.7")
    Weight 6.2 kg

    Included

    • 1x T-962 v2.0 Reflow Soldering Oven (Elektor Version)
    • 1x USB Stick (with Manual and Software)
    • 2x Fuses
    • 1x Power cord (EU)

    Downloads


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