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This upgraded version 2.0 (available exclusively from Elektor) contains the following improvements: Enhanced protective earthing (PE) for furnace chassis Extra thermal insulation layer around furnace to reduce odors Connection to a computer, allowing curve editing on a PC Features such as constant temperature control and timing functions The infrared IC heater T-962 v2.0 is a microprocessor-controlled reflow oven that you can use for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared emission and circulation of the hot air flow, so the temperature is being kept very accurate and evenly distributed. A windowed drawer is designed to hold the work-piece, and allows safe soldering techniques and the manipulation of SMDBGA and other small electronic parts mounted on a PCB assembly. The T-962 v2.0 may be used to automatically rework solder to correct bad solder joints, remove/replace bad components and complete small engineering models or prototypes. Features Large infrared soldering area Effective soldering area: 180 x 235 mm; this increases the usage range of this machine drastically and makes it an economical investment. Choice of different soldering cycles Parameters of eight soldering cycles are pre defined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down. Special heat up and temperature equalization with all designs Uses up to 800 Watts of energy efficient Infrared heating and air circulation to re-flow solder. Ergonomic design, practical and easily operated Good build quality but at the same time light weight and a small footprint allows the T-962 v2.0 to be easily bench positioned transported or stored. Large number of available functions The T-962 v2.0 can solder most small parts of PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production. Specifications Soldering area (max) 180 x 235 mm (7.1 x 9.3") Power (max) 800 W Temperature range 0-280°C (32-536°F) Heating method Infrared Processing time 1~8 minutes Power supply 220 V AC/50 Hz Display LCD with Backlight Control mode 8 intelligent temperature curves Dimensions 310 x 290 x 170 mm (12.2 x 11.4 x 6.7") Weight 6.2 kg Included 1x T-962 v2.0 Reflow Soldering Oven (Elektor Version) 1x USB Stick (with Manual and Software) 2x Fuses 1x Power cord (EU) Downloads Manual

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The Siglent SDS1204X-E is a powerful 200 MHz four-channel oscilloscope that is built on the same platform as the very popular SDS1202X-E but with several significant improvements, including two 1 GSa/s ADCs and two 14 Mpt memory modules. Waveform capture rates are up to 100,000 wfms/s in normal mode and 400,000 wfms/s in sequence mode. The SDS1000X-E scopes feature a large 7” 256-level color display with intensity grading and color temperature features. Specifications Bandwidth 200 MHz Sampling Rate (Max.) 1 GSa/s Channels 2CH+EXT4CH Memory Depth (Max.) 7 Mpts/CH (not interleave mode); 14 Mpts/CH (interleave mode) Waveform Capture Rate (Max.) 100,000 wfms/s (normal mode), 400,000 wfms/s (sequence mode) Trigger Types Edge, Slope, Pulse width, Window, Runt, Interval, Dropout, Pattern, Video Serial Trigger (Standard) I²C, SPI, UART/RS232, CAN, LIN Decode Type (Standard) I²C, SPI, UART/RS232, CAN, LIN 16 Digital Channels (four channel series only, option) Maximum waveform capture rate up to 1 GSa/s, Record length up to 14 Mpts/CH USB AWG module (four channel series only, option) One channel, 25 MHz, sample rate of 125 MHz, wave length of 16 kpts Bode plot ( four channel series only) Minimum start frequency of 10 Hz, minimum scan bandwith of 500 Hz, maximum scan bandwidth of 120 MHz (dependent on Oscilloscope and AWG bandwidth), 500 maximum scan frequency points USB WIFI adapter (four channel series only, option) 802.11b/g/b, WPA-PSK, the adapter must be supplied by Siglent to ensure proper functioning Downloads Datasheet Manual Programming Guide

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This adjustable circuit board holder is ideal for clamping PCB for soldering, desoldering or rework. Features 2 adjustable grips on a retractable stand to accommodate various board sizes. The adjustable clamps allow the PCB to rotate 360 degrees and stay set in any position. The base of this rigid metal stand features four rubber feet to ensure stability. Specifications Product size 30 x 16.5 x 12.5 cm Max. holding size 20 x 14 cm Weight 450 g

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The BB830T is a solderless (plug-in) transparent breadboard with 830 connection tie-points (i.e. 830 wire insertion holes). It has 4 power rails. Solderless breadboards are great for building and testing new circuits because parts can be easily inserted and removed. They are completely re-usable. The BB830T has a 630 tie-point IC-circuit area plus four 50 tie-point power rails. Specifications 830 tie points total: 630 tie-point IC-circuit area plus two 100 tie-point distribution strips providing 4 power rails. ABS plastic/transparent body with black printed legend. Color legend on distribution strips. Contacts are Phosphor Bronze with Plated Nickel Finish, rated for 50,000 insertions. Rated at 36 Volts, 2 Amps. Insertion Wire Size is 21 to 26 AWG, 0.016 to 0.028 inches diameter (0.4 to 0.7mm diameter). Peelable adhesive tape backing provided for attaching to a surface. Metal back plate provided.

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Raspberry Pi 5 provides two four-lane MIPI connectors, each of which can support either a camera or a display. These connectors use the same 22-way, 0.5 mm-pitch “mini” FPC format as the Compute Module Development Kit, and require adapter cables to connect to the 15-way, 1 mm-pitch “standard” format connectors on current Raspbery Pi camera and display products.These mini-to-standard adapter cables for cameras and displays (note that a camera cable should not be used with a display, and vice versa) are available in 200 mm, 300 mm and 500 mm lengths.

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Raspberry Pi 5 provides two four-lane MIPI connectors, each of which can support either a camera or a display. These connectors use the same 22-way, 0.5 mm-pitch “mini” FPC format as the Compute Module Development Kit, and require adapter cables to connect to the 15-way, 1 mm-pitch “standard” format connectors on current Raspbery Pi camera and display products.These mini-to-standard adapter cables for cameras and displays (note that a camera cable should not be used with a display, and vice versa) are available in 200 mm, 300 mm and 500 mm lengths.

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Raspberry Pi 5 provides two four-lane MIPI connectors, each of which can support either a camera or a display. These connectors use the same 22-way, 0.5 mm-pitch “mini” FPC format as the Compute Module Development Kit, and require adapter cables to connect to the 15-way, 1 mm-pitch “standard” format connectors on current Raspbery Pi camera and display products.These mini-to-standard adapter cables for cameras and displays (note that a camera cable should not be used with a display, and vice versa) are available in 200 mm, 300 mm and 500 mm lengths.

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Raspberry Pi 5 provides two four-lane MIPI connectors, each of which can support either a camera or a display. These connectors use the same 22-way, 0.5 mm-pitch “mini” FPC format as the Compute Module Development Kit, and require adapter cables to connect to the 15-way, 1 mm-pitch “standard” format connectors on current Raspbery Pi camera and display products.These mini-to-standard adapter cables for cameras and displays (note that a camera cable should not be used with a display, and vice versa) are available in 200 mm, 300 mm and 500 mm lengths.

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Raspberry Pi 5 provides two four-lane MIPI connectors, each of which can support either a camera or a display. These connectors use the same 22-way, 0.5 mm-pitch “mini” FPC format as the Compute Module Development Kit, and require adapter cables to connect to the 15-way, 1 mm-pitch “standard” format connectors on current Raspbery Pi camera and display products.These mini-to-standard adapter cables for cameras and displays (note that a camera cable should not be used with a display, and vice versa) are available in 200 mm, 300 mm and 500 mm lengths.

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The Piccolino rapid development board can be used to design microcontroller circuits quickly. The Piccolino has a fast 16f887 PIC microcontroller, voltage regulator, and communications module, and can be easily extended using its four headers. This e-book contains 30 projects based on the Piccolino. We'll use its unique communications facilities and get the Piccolino to communicate with programs on a PC. On the PC, we use the free programming language Small Basic. You can use this to create Windows programs with buttons and graphs quickly. You will learn how to analyze components such as inductors, capacitors, and OPAMPs, and how to display the measurement results in a graphical format. This will help you to design your circuits easily. We will then start to adapt to the Piccolino. We'll add components to it to make it more powerful, with extra features such as flow control and digital to analog conversion. The clear instructions will enable you to design and build your adaptations. This way you can make your custom designed Piccolino. We'll end up making an extension: a PCB that that can be mounted on the Piccolino headers. As an example, we'll design and build an extension for an LCD. You can use the included board layout to make your PCB or have it made for you. At the same time, you will learn how to make your extensions. The only limitation is your imagination! The clear descriptions along with circuit diagrams and photos, will make the building of these projects an enjoyable experience. Each project has a clear explanation of the reasons why it was designed in a particular way. This helps you learn a lot about the Piccolino, as well as Small Basic, and the components that are used in this e-book. You can adapt the projects to suit your requirements or combine several projects.

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The SMD Starter I prototype production line consists of the stencil printer TSD240, the SMD placement device PlaceMAN and the reflow oven 3LHR10. Stencil printer SD240 (+ Metal Squeegee 155 mm) Stencil size: max. 175 x 255 mm PCB size: max. 180 x 240 mm Size: 410 x 270 x 110 mm Weight: 6.7 kg incl. metal squeegee 155 mm incl. 8 magnets to hold the PCB, 6 of them with M3 grub screw Manual SMD pick-and-place device PlaceMAN for standard components incl. vacuum pump (without feeders, camera, monitor and dispenser) Equipped with smooth-running placement arm, placement head with one-hand operation, rotation of the Z-axis and automatic vacuum switch-off, incl. PCB holder, vacuum unit and 2 placement needles with rubber suction cups. Capacity of feeder (not included) 2x feeder cassette for 10 x 8 mm wheels left 4x feeder cassette for rod feeders for 5 rods each Further feeding systems are possible within the assembly area, e.g. strip-feeder plug-in system Dimensions Base unit (LxWxH): 765 x 390 x 210 mm With feeder cassette for 10 x 8 mm rolls (LxWxH): 765 x 390 x 210 mm With feeder cassette for 10 x 8 mm rolls and feeder cassette for rod feeder (LxWxH): 765 x 430 x 210 mm (height may vary due to rod length) With feeder cassette for 10 x 8 mm rolls incl. holder for 10 rolls and feeder cassette for rod feeder (LxWxH): 765 x 430 x 210 mm (height may vary due to rod length) Specifications Weight of basic unit: approx. 6 kg Axis travel (x,y,z): 470 x 230 x 15 mm Max. working area: 380 x 240 mm Max. PCB size: 230 x 360 mm Power supply: 230/12 V, 800 mA Power supply vacuum pump: 230 V, 6 W 3LHR10 Reflow Oven (programmable for lead-free soldering with manual drawer and tablet control) Reflow oven with IR and convection heating. Forced hot air convection ensures a uniform temperature profile throughout the chamber. After manually opening the door, the fans are turned on and the soldered PCB is quickly cooled. Small reflow oven with manual door Industry 4.0 ready, Bluetooth communication + tablet IR + convection heating Android application to connect to tablet or smartphone 100 different user programs Delivery content: 3LHR10, tablet with app, protective cover for tablet, 4 PCB holders, external thermocouple, manual at tablet Application Connect the oven to the power supply and connect the optionally available extraction system (3LFE10S) to the exhaust air nozzle. After the first turn on, the oven will search for a tablet or smartphone. When both are connected to the Android app, choose the programming of the oven. Here, programmable temperature and preheating time as well as temperature and other data are to be set. Register with the tablet to use the full scope of the software. If the oven is already programmed, the user can control the operation with buttons and display at the front panel. When the reflow process is complete, an audible signal sounds. A signal is also displayed on the tablet/smartphone. The drawer must now be opened manually. The Android application displays process status, time and temperature or other information. Specifications Power supply: 230 V, 50 Hz Maximum power: 3100 W Temperatures: 50-260°C Dimensions: 510 x 370 x 340 mm Maximum weight: 16 kg Grid dimensions: 350 x 220 mm Maximum dimensions of the printed circuit board: 300 x 200 mm Maximum component height on the PCB: 50 mm at the top, 30 mm at the bottom Scope of delivery Stencil printer TSD240 SMD placement device PlaceMAN Reflow oven 3LHR10

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