This upgraded version 2.0 (available exclusively from Elektor) contains the following improvements: Enhanced protective earthing (PE) for furnace chassis Extra thermal insulation layer around furnace to reduce odors Connection to a computer, allowing curve editing on a PC Features such as constant temperature control and timing functions The infrared IC heater T-962 v2.0 is a microprocessor-controlled reflow oven that you can use for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared emission and circulation of the hot air flow, so the temperature is being kept very accurate and evenly distributed. A windowed drawer is designed to hold the work-piece, and allows safe soldering techniques and the manipulation of SMDBGA and other small electronic parts mounted on a PCB assembly. The T-962 v2.0 may be used to automatically rework solder to correct bad solder joints, remove/replace bad components and complete small engineering models or prototypes. Features Large infrared soldering area Effective soldering area: 180 x 235 mm; this increases the usage range of this machine drastically and makes it an economical investment. Choice of different soldering cycles Parameters of eight soldering cycles are pre defined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down. Special heat up and temperature equalization with all designs Uses up to 800 Watts of energy efficient Infrared heating and air circulation to re-flow solder. Ergonomic design, practical and easily operated Good build quality but at the same time light weight and a small footprint allows the T-962 v2.0 to be easily bench positioned transported or stored. Large number of available funtions The T-962 v2.0 can solder most small parts of PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production. Specifications Soldering area (max) 180 x 235 mm (7.1 x 9.3") Power (max) 800 W Temperature range 0-280°C (32-536°F) Heating method Infrared Processing time 1~8 minutes Power supply 220 V AC/50 Hz Display LCD with Backlight Control mode 8 intelligent temperature curves Dimensions 310 x 290 x 170 mm (12.2 x 11.4 x 6.7") Weight 6.2 kg Included 1x T-962 v2.0 Reflow Soldering Oven (Elektor Version) 1x USB Stick (with Manual and Software) 2x Fuses 1x Power cord (EU) Downloads Manual

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