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This upgraded version 2.0 (available exclusively from Elektor) contains the following improvements: Enhanced protective earthing (PE) for furnace chassis Extra thermal insulation layer around furnace to reduce odors Connection to a computer, allowing curve editing on a PC Features such as constant temperature control and timing functions The infrared IC heater T-962 v2.0 is a microprocessor-controlled reflow oven that you can use for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared emission and circulation of the hot air flow, so the temperature is being kept very accurate and evenly distributed. A windowed drawer is designed to hold the work-piece, and allows safe soldering techniques and the manipulation of SMDBGA and other small electronic parts mounted on a PCB assembly. The T-962 v2.0 may be used to automatically rework solder to correct bad solder joints, remove/replace bad components and complete small engineering models or prototypes. Features Large infrared soldering area Effective soldering area: 180 x 235 mm; this increases the usage range of this machine drastically and makes it an economical investment. Choice of different soldering cycles Parameters of eight soldering cycles are pre defined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down. Special heat up and temperature equalization with all designs Uses up to 800 Watts of energy efficient Infrared heating and air circulation to re-flow solder. Ergonomic design, practical and easily operated Good build quality but at the same time light weight and a small footprint allows the T-962 v2.0 to be easily bench positioned transported or stored. Large number of available functions The T-962 v2.0 can solder most small parts of PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production. Specifications Soldering area (max) 180 x 235 mm (7.1 x 9.3") Power (max) 800 W Temperature range 0-280°C (32-536°F) Heating method Infrared Processing time 1~8 minutes Power supply 220 V AC/50 Hz Display LCD with Backlight Control mode 8 intelligent temperature curves Dimensions 310 x 290 x 170 mm (12.2 x 11.4 x 6.7") Weight 6.2 kg Included 1x T-962 v2.0 Reflow Soldering Oven (Elektor Version) 2x Fuses 1x Power cord (EU)

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Mastering Surface Mount Technology takes you on a crash course in techniques, tips and know-how to successfully introduce surface mount technology in your workflow. Even if you are on a budget you too can jumpstart your designs with advanced fine pitch parts. Besides explaining methodology and equipment, attention is given to SMT parts technologies and soldering methods. In a step by step way, several projects introduce you to handling surface mount parts and the required skills to successfully build SMT assemblies. Many practical tips and tricks are disclosed that bring surface mount technology into everyone's reach without breaking the bank.

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Practical Low-Cost Methods for Reliable PCB Production This book explains how to carry out reliable SMD assembly using affordable tools and small-scale equipment. It follows the complete workflow step by step, including tool selection, solder paste handling, stencil use, component placement, reflow methods, inspection, and rework. The focus is on bench-level and small-lab production rather than industrial assembly lines. It shows practical methods for building single and double-sided SMD boards with repeatable results. Topics include solder paste and flux, temperature profiles, hot air and hotplate techniques, small reflow ovens, inspection methods, and defect correction. Checklists and example workflows are included to help reduce errors and improve consistency. Key features: Tools and supplies for SMD assembly and rework Solder paste types, storage, and handling Stencils and paste application methods Pick and place workflow and component orientation Temperature profiles and reflow methods Hot air, hotplate, and reflow oven processes Inspection and quality control Common defects such as tombstoning and solder bridges Practical rework and component replacement Bench-level professional workflows and checklists This book is designed as a practical bench reference for anyone who wants to assemble and troubleshoot their own SMD boards with reliable results.

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