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Fast Reliable Vias

(Summer Circuits 2010 article)

Published in issue 403, July/August 2010

There are several techniques for providing lab-grade contacts from one track side to the other on DIY printed circuit boards. They range from thin wire or solder pins through pressed-in hollow rivets (e.g. from Bungard) and through-contact sleeves (e.g. from ELV) to through-contact rivets (e.g. LPKF ‘EasyContac’). These ‘vias’ can also be produced using electrical techniques or with solder paste.

Relevant websites

www.harwin.com/search/T1559F46?ProductSearch=True
www.harwin.com/include/downloads/tis/IS-06.PDF

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