SMD Reflow Soldering Oven
SMD boards hot from the oven
Published in issue 350, January 2006
It’s usually possible to solder ‘ordinary’ SMD components using a low-power soldering iron and small-gauge solder. However, it’s a completely different story when you have to solder a component in a BGA, CSP or similar package. Such components can actually only be soldered using a reflow soldering oven. Here we describe how a normal, inexpensive oven can be transformed into a reflow oven.
Resistors:
R1,R2 = 150
R3 = 10
R4 = SIL array 8 x 10k
R5 = SIL array 4 x 1k
R6 = 10k
P1 = 10k
Capacitors:
C1,C4,C5,C12,C13,C15 = 100nF
C2,C3 = 27pF
C6-C9,C14 = 10µF 16V radial
C10,C11 = 470µF 16V radial
Semiconductors:
B1 = B80C1500 bridge rectifier, 80V piv, 1.5A
D1,D2,D3 = LED, red, low-current
IC1 = MAX6675
IC2 = AT89C52/24JI, programmed, order code 050319-41
IC3 = MAX232
IC4,IC5 = S202S12
IC6 = 24LC64
IC7 = 7805
Miscellaneous:
K1 = connector for thermocouple
Thermocouple, K-type
K2 = 9-way sub-D socket (female), PCB mount
K3,K4,K5 = 2-way PCB terminal block, lead pitch 7.5mm
K6 = connection for LCD backlight LCD1 = LCD module, 2x16 characters, e.g. order code 030451-72 or PLED version 030451-73
S1-S6 = pushbutton, ITT type D6-R
Tr1 = mains transformer, primary 230V, secondary. 6V (e.g. Monacor/Monarch VTR-3106)
X1 = 12 MHz quartz crystal
PCB, ref. 050319-1 from The PCBShop
Disk, source and hex code files, order code 050319-11
17 wire links
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Click below to download a PDF copy of this article from Elektor magazine. Please note. In view of the complexity of international markets, Elektor cannot guarantee the availability of components for this project.
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